Aligner | 제일인터내셔널

High level of cleanliness performance	Suppresses the generation of particles by minimizing the contact area
High speed alignment	on-contact (sensor system), supports orientation flat type and notch type wafers Achieves advanced alignment by high speed processing with an alignment time 2 seconds or lower and a correction accuracy of ±0.2°.

High level of cleanliness performance

Suppresses the generation of particles by minimizing the contact area

High speed alignment

on-contact (sensor system), supports orientation flat type and notch type wafers
Achieves advanced alignment by high speed processing with an alignment time 2 seconds or lower and a correction accuracy of ±0.2°.

High level of cleanliness performance	Suppresses the generation of particles by minimizing the contact area
High speed alignment	on-contact (sensor system), supports orientation flat type and notch type wafers Achieves advanced alignment by high speed processing with an alignment time 2 seconds or lower and a correction accuracy of ±0.2°.

High level of cleanliness performance

Suppresses the generation of particles by minimizing the contact area

High speed alignment

300 mm edge grip prealigner

Sensor method for contactless, particle suppression

Features

High level of cleanliness performance	Employs an edge grip mechanism that reduces particle contamination by not touching the bottom of the wafer
High speed, high accuracy	High speed and high accuracy through the use of high resolution absolute AC servo motors
High performance	Supports retention check via wafer grip sensor, ESD measures with the use of electrically-conductive materials and conductive material treatments